Electronic device having an under-fill element, a mounting method of the same, and a method of manufacturing a display apparatus having the electronic device

ABSTRACT

A mounting method of an electronic device includes providing an electronic device which includes a semiconductor chip body including an upper surface, a lower surface opposite to the upper surface, and side surfaces connecting the upper surface and the lower surface, a plurality of bumps disposed on the lower surface, and an under-fill element disposed on at least one side surface. The method further includes mounting the electronic device on a printed circuit board including connecting pads formed thereon. The bumps of the semiconductor chip body are connected to the connecting pads. The method additionally includes heating the under-fill element to a predetermined temperature to form an under-fill layer between the lower surface of the semiconductor chip body and the printed circuit board.

CROSS-REFERENCE TO RELATED APPLICATION

This application claims priority under 35 USC § 119 to Korean PatentApplication No. 10-2016-0098155 filed on Aug. 1, 2016 in the KoreanIntellectual Property Office, the disclosure of which is incorporated byreference herein in its entirety.

TECHNICAL FIELD

Exemplary embodiments of the present inventive concept relate to anelectronic device, mounting method of the electronic device, and amethod of manufacturing a display apparatus having the electronicdevice. More particularly, exemplary embodiments of the presentinventive concept relate to an electronic device having an under-fillelement, mounting method of the electronic device, and a method ofmanufacturing a display apparatus having the electronic device.

DISCUSSION OF THE RELATED ART

Various techniques for mounting electronic devices on printed circuitboards are under current development.

To secure the electronic device on the printed circuit board, anunder-fill may fill any gap between the electronic device and theprinted circuit board to provide cohesion between the electronic deviceand the printed circuit board.

SUMMARY

According to an exemplary embodiment of the present inventive concept,an electronic device includes a semiconductor chip body including anupper surface, a lower surface opposite to the upper surface, and sidesurfaces connecting the upper surface and the lower surface. Theelectronic device further includes a plurality of bumps disposed on thelower surface of the semiconductor chip body and an under-fill elementdisposed on at least one side surface.

According to an exemplary embodiment of the present inventive concept, amounting method of an electronic device includes providing an electronicdevice which includes a semiconductor chip body including an uppersurface, a lower surface opposite to the upper surface, and sidesurfaces connecting the upper surface and the lower surface, a pluralityof bumps disposed on the lower surface, and an under-fill elementdisposed on at least one side surface. The method further includesmounting the electronic device on a printed circuit board includingconnecting pads formed thereon. The bumps of the semiconductor chip bodyare connected to the connecting pads. The method additionally includesheating the under-fill element to a predetermined temperature to form anunder-fill layer between the lower surface of the semiconductor chipbody and the printed circuit board.

According to an exemplary embodiment of the present inventive concept, amethod of manufacturing a display apparatus includes providing anelectronic device which includes a semiconductor chip body including anupper surface, a lower surface opposite to the upper surface, and sidesurfaces connecting the upper surface and the lower surface, a pluralityof bumps disposed on the lower surface, and an under-fill elementdisposed on at least one side surface. The method further includesmounting the electronic device on a flexible substrate including aflexible material, and the flexible substrate is a base substrate of thedisplay apparatus. Connecting pads are formed on the flexible substrateand are connected to the bumps of the semiconductor chip body. Themethod additionally includes heating the under-fill element to apredetermined temperature to form an under-fill layer between the lowersurface of the semiconductor chip body and the flexible substrate.

BRIEF DESCRIPTION OF THE DRAWINGS

The above and other features of the present inventive concept willbecome more apparent by describing in detail exemplary embodimentsthereof, with reference to the accompanying drawings, in which:

FIG. 1A is a perspective view illustrating an electronic deviceaccording to an exemplary embodiment of the present inventive concept;

FIG. 1B is a side view illustrating the electronic device of FIG. 1A;

FIG. 2A is a perspective view illustrating an electronic deviceaccording to an exemplary embodiment of the present inventive concept;

FIG. 2B is a side view illustrating the electronic device of FIG. 2A;

FIG. 3A is a perspective view illustrating an electronic deviceaccording to an exemplary embodiment of the present inventive concept;

FIG. 3B is a side view illustrating the electronic device of FIG. 3A;

FIGS. 4A and 4B are perspective views illustrating electronic devicesaccording to an exemplary embodiment of the present inventive;

FIGS. 5A to 5C are cross-sectional views illustrating a mounting methodof the electronic device of FIGS. 1A and 1B or FIGS. 2A and 2B;

FIGS. 6A to 6C are cross-sectional views illustrating a mounting methodof the electronic device of FIGS. 3A and 3B; and

FIGS. 7A and 7B are cross-sectional views illustrating a displayapparatus having an electronic device which is mounted thereon using amounting method according to an exemplary embodiment of the presentinventive concept.

DETAILED DESCRIPTION OF THE EMBODIMENTS

Exemplary embodiments of the present inventive concept will be describedin more detail below with reference to the accompanying drawings, inwhich exemplary embodiments of the preset inventive concept are shown.

FIG. 1A is a perspective view illustrating an electronic deviceaccording to an exemplary embodiment of the present inventive concept.FIG. 1B is a side view illustrating the electronic device of FIG. 1A.

Referring to FIGS. 1A and 2A, the electronic device may include asemiconductor chip body 100, a plurality of bumps 110 and an under-fillelement 120.

The semiconductor chip body 100 may include a lower surface 102, anupper surface 104 (e.g., shown in FIG. 1B) opposite to the lower surface102, a first side surface 106 connecting the upper surface 104 to thelower surface 102, a second side surface opposite to the first sidesurface 106, a third side surface 108, and a fourth side surfaceopposite to the third side surface 108. Thus, the first side surface 106and the second side surface may extend in a first direction D1, and thethird side surface 108 and the fourth side surface may extend in asecond direction D2, which is substantially perpendicular to the firstdirection D1.

An integrated circuit (IC) chip may be embedded in the semiconductorchip body 100.

The bumps 110 may be formed on the lower surface 102 of thesemiconductor chip body 100. The bumps 110 may be arranged to form aball grid array (BGA).

A plurality of grooves may be formed on the first to fourth sidesurfaces 106 and 108. The under-fill element 120 may be disposed in eachgroove of the plurality of grooves. Each groove of the plurality ofgrooves may extend along the first side surface 106 and to the lowersurface 102 of the semiconductor chip body 100, so that the under-fillelement 120 in the groove may be exposed from the lower surface 102. Forexample, each groove of the plurality of grooves may have a radius ofcurvature that extends in the first direction D1.

Each of the grooves may have a semi-cylindrical shape which has asemicircle on the lower surface 102. The under-fill element 120 may havea semi-cylindrical shape, because the under-fill element 120 is receivedin the groove which has a semi-cylindrical shape. Accordingly, a shapeof the under-fill element 120 may correspond to a shape of the groovewhen the under-fill element 120 is disposed in the groove. A portion ofthe under-fill element 120 may protrude from the lower surface 102 ofthe semiconductor chip body 100. The under-fill element 120 may beformed by filling the groove with an under-fill resin.

Referring again to FIG. 1B, in a side view of the electronic device,each groove may be disposed between two bumps 110 adjacent to eachother. Further, the groove may extend toward the upper surface 104 ofthe semiconductor chip body such that the groove may reach,approximately, a middle region of the first to fourth side surfaces 106and 108 that is between the upper surface 104 and the lower surface 102.Accordingly, the under-fill element 120 may extend toward the uppersurface 104 such that the under-fill element may reach, approximately,the middle region of the first to fourth sides surfaces 106 and 108 whenthe under-fill layer (refers to FIG. 3C) is formed.

FIG. 2A is a perspective view illustrating an electronic deviceaccording to an exemplary embodiment of the present inventive concept.FIG. 2B is a side view illustrating the electronic device of FIG. 2A.

Referring to FIGS. 2A and 2B, the electronic device may be substantiallya same as the electronic device of FIGS. 1A and 1B, except that anunder-fill element 120 of the electronic device has a triangular prismshape. Thus, any further detailed descriptions concerning elements thatmay be assumed to be the same will be briefly described or omitted.

The electronic device may include a semiconductor chip body 100, aplurality of bumps 110 and an under-fill element 120. The semiconductorchip body 100 may include a lower surface 102, an upper surface 104, andfirst to fourth side surfaces 106 and 108.

A plurality of grooves may be formed on the first to fourth sidesurfaces 106 and 108. The under-fill element 120 may be disposed in eachgroove of the plurality of grooves. Each groove may extend along thefirst side surface 106 and may extend towards the lower surface 102, sothat the under-fill element 120 in the groove may be exposed from thelower surface 102.

Each of the grooves may have a triangular prism shape which may have atriangular shape on the lower surface 102. The under-fill element 120may have a triangular prism shape, because the under-fill element 120 isreceived in the groove which has a triangular prism shape.

Although the under-fill element 120 has the triangular prism shape in anexemplary embodiment of the present inventive concept, the under-fillelement 120 may have various shapes. For example, the groove and theunder-fill element 120 may have a quadrangular prism shape. Anystructure is acceptable as long as the groove extends along the first,second, third or fourth side surfaces 106 or 108 and extends towards thelower surface 102 for exposing the under-fill element 120 from the lowersurface 102. For example, a width of the triangular prism shaped groove(e.g., width of the base of the triangular prism shaped groove) mayextend along the first, second, third or fourth side surfaces 106 or108.

FIG. 3A is a perspective view illustrating an electronic deviceaccording to an exemplary embodiment of the present inventive concept.FIG. 3B is a side view illustrating the electronic device of FIG. 3A.

Referring to FIGS. 3A to 3B, the electronic device may be substantiallya same as the electronic device of FIGS. 1A and 1B, except for anunder-fill film 220. Thus, any further detailed descriptions concerningelements that may appear to be the same will be briefly described oromitted.

The electronic device may include a semiconductor chip body 100, aplurality of bumps 110 and an under-fill film 220. For example, theunder-fill element 120 may be similar to the under-fill film 220. Thesemiconductor chip body 100 may include a lower surface 102, an uppersurface 104, and first to fourth side surfaces 106 and 108.

The under-fill film 220 may be disposed on the first to fourth sidesurfaces 106 and 108. The under-fill film 220 may be formed by attachinga film, which includes an under-fill resin and has an adhesive property.

FIGS. 4A and 4B are perspective views illustrating electronic devicesaccording to an exemplary embodiment of the present inventive.

Referring to FIG. 4A, the electronic device may be substantially same asthe electronic device of FIGS. 1A and 1B, except that an under-fillelement 120 and grooves formed on the side surfaces may be formed onlyon a first side surface 106 and a fourth side surface 109. However,exemplary embodiments of the present inventive concept are not limitedthereto. For example, the under-fill element 120 and the grooves formedon the side surfaces may be formed only on a second side surface 107 anda third side surface 108. Thus, any further detailed descriptionsconcerning elements that may be assumed to the same may be omitted.

Referring to FIG. 4B, the electronic device may be substantially a sameas the electronic device of FIGS. 1A and 1B, except that an under-fillelement 120 and grooves formed on the side surfaces are formed only afirst side surface 106, a second side surface 107 and a fourth sidesurface 109. However, exemplary embodiments of the present inventiveconcept are not limited thereto. For example, the under-fill element 120and the grooves formed on the side surfaces may be formed only on afirst side surface 106, a second side surface 107 and a third sidesurface 108. Thus, any further detailed descriptions concerning elementsthat may be assumed to be the same may be omitted.

Although the under-fill element 120 and the grooves each of which mayhave the semi-cylindrical shape formed only on the first side surface106 and the fourth side surface 109 or only on the first side surface106, the second side surface 107 and the fourth side surface 109 in anexample embodiment of the present inventive concept, the under-fillelement 120 may have various shapes and may be disposed on thesemiconductor chip body 100.

FIGS. 5A to 5C are cross-sectional views illustrating a mounting methodof the electronic device of FIGS. 1A and 1B or FIGS. 2A and 2B.

Referring to FIG. 5A, a printed circuit board 10 and the electronicdevice may be provided. The electronic device may be the electronicdevice of FIGS. 1A and 1B or FIGS. 2A and 2B. The electronic device mayinclude a semiconductor chip body 100, a plurality of bumps 110 and anunder-fill element 120. The under-fill element 120 of the electronicdevice may be formed by filling the groove formed on a side surface ofthe semiconductor chip body 100 with an under-fill resin.

A plurality of connecting pads 12 may be formed on the printed circuitboard 10. The connecting pads 12 may be formed to correspond to thebumps 110 of the electronic device.

Referring to FIG. 5B, the electronic device may be disposed on theprinted circuit board 10. The electronic device may be aligned with theprinted circuit board 10, so that each of the bumps 110 of theelectronic device is corresponding to each of the connecting pads 12 ofthe printed circuit board 10.

Referring to FIG. 5C, by heating the under-fill element 120 while it isin a solid phase to a predetermined temperature, an under-fill layer 122between the semiconductor chip body 100 and the printed circuit board 10may be formed. When the under-fill element 120 is heated, its phase maychange to a liquid phase, so that the under-fill layer 122 between thesemiconductor chip body 100 and the printed circuit board 10 may beformed. For example, the under-fill element may be heated to its meltingpoint temperature. A coating treatment may be performed on the uppersurface of the printed circuit board 10. Thus, when the under-fillelement 120 is changed to the liquid phase, the under-fill element 120may move along the upper surface of the printed circuit board 10, whichis coated with the treatment, to a central portion of the upper surfaceof semiconductor chip body 100. Accordingly, the under-fill layer 122between the semiconductor chip body 100 and the printed circuit board 10may be formed.

For example, the bump 110 may be partially melted and connected to theconnecting pad 12.

Although the under-fill element 120 is heated to form the under-filllayer 122 in an exemplary embodiment of the present inventive concept,it is not limited thereto. For example, when the under-fill element 120includes a material which may be melted by ultraviolet rays, theunder-fill layer 122 may be formed by irradiating ultraviolet rays tothe under-fill element 120.

According to the mounting method of the electronic device, theelectronic device which has the under-fill element 120 in the groove atthe side surface of the semiconductor chip body may be used. Thus, workefficiency of the mounting method may be improved.

In addition, the under-fill element 120 is formed on the electronicdevice before mounting the electronic device. Thus, even if there islimited space on the printed circuit board 10, the electronic device maybe mounted on the printed circuit board efficiently.

FIGS. 6A to 6C are cross-sectional views illustrating a mounting methodof the electronic device of FIGS. 3A and 3B. The mounting method of theelectronic device may be substantially a same as the mounting method ofFIGS. 5A to 5C, except for attaching an under-fill film 220. Thus, anyfurther detailed descriptions concerning elements that may be assumed tobe the same may be briefly described or omitted.

Referring to FIG. 6A, a printed circuit board 10 and the electronicdevice may be provided. The electronic device may be the electronicdevice of FIGS. 3A to 3B. The electronic device may include asemiconductor chip body 100, a plurality of bumps 110 and an under-fillfilm 220. The under-fill film 220 of the electronic device may be formedby attaching a film including an under-fill resin and having adhesiononto the first to fourth side surfaces 106 and 108. A plurality ofconnecting pads 12 may be formed on the printed circuit board 10.

Referring to FIG. 6B, the electronic device may be disposed on theprinted circuit board 10. In addition, the electronic device may bealigned with the printed circuit board 10.

Referring to FIG. 6C, by heating the under-fill film 220 to apredetermined temperature while in its solid phase, an under-fill layer222 between the semiconductor chip body 100 and the printed circuitboard 10 may be formed. For example, the under-fill film 220 may beheated to its melting point temperature. As an additional example, thebump 110 may be partially melted and connected to the connecting pad 12.

FIGS. 7A and 7B are cross-sectional views illustrating a displayapparatus having an electronic device which is mounted thereon using amounting method according to an exemplary embodiment of the presentinventive concept.

Referring to FIGS. 7A and 7B, the electronic device may be mounted on aflexible substrate 20 which is used for a base substrate of the displayapparatus. The flexible substrate 20 may be formed using a flexiblematerial, so that the flexible substrate 20 is bendable.

An under-fill layer 122 may be formed between the electronic device andthe flexible substrate 20. Thus, although the flexible substrate 20 isbent, a bump 110 of the electronic device might not be damaged, and aconnection with a connecting pad 12 of the flexible substrate 20 may bemaintained. Especially, for a curved display apparatus or a flexibledisplay apparatus, the electronic device may be firmly mounted on theflexible substrate 20 despite any deformation or degree of curvature ofthe flexible substrate 20.

According to the present inventive concept, the electronic device, whichhas the under-fill element in the groove at the side surface of thesemiconductor chip body, is used for the mounting method. Thus, workefficiency of the mounting method may be improved in comparison with aprior art which includes injecting under-fill resin or attachingunder-fill film directly on the printed circuit board.

In addition, the under-fill element is already formed on the electronicdevice before mounting the electronic device. Thus, even though theremay be limited space on the printed circuit board, the electronic devicecan be mounted on the printed circuit board, efficiently.

While the present inventive concept has been particularly shown anddescribed with reference to exemplary embodiments thereof, it will beapparent to those of ordinary skill in the art that various changes inform and detail may be made thereto without departing from the spiritand scope of the present inventive concept as defined by the followingclaims.

What is claimed is:
 1. An electronic device, comprising: a semiconductorchip body including an upper surface, a lower surface opposite to theupper surface, and side surfaces connecting the upper surface and thelower surface; a plurality of bumps disposed on the lower surface of thesemiconductor chip body; and an under-fill element disposed on at leastone side surface.
 2. The electronic device of claim 1, wherein aplurality of grooves is formed on at least one side surface, and theunder-fill element is disposed in the plurality of grooves.
 3. Theelectronic device of claim 2, wherein each groove of the plurality ofgrooves extends along the side surface and towards the lower surface ofthe semiconductor chip body, and the under-fill element disposed in eachgroove of the plurality of grooves is exposed from the lower surface. 4.The electronic device of claim 3, wherein each groove of the pluralityof grooves and the under-fill element have a semi-cylindrical shape or atriangular prism shape.
 5. The electronic device of claim 4, whereineach groove of the plurality of grooves is disposed between two bumpsadjacent to each other in a side surface view.
 6. The electronic deviceof claim 1, wherein the under-fill element is an under-fill filmattached to at least one side surface.
 7. The electronic device of claim6, wherein each side surface is substantially perpendicular to the upperand lower surfaces.
 8. The electronic device of claim 1, wherein theside surfaces comprise a first side surface, a second side surfaceopposite to the first side surface, a third side surface and a fourthside surface opposite to the third side surface, and wherein theunder-fill element is disposed on the first side surface and the thirdside surface.
 9. The electronic device of claim 8, wherein theunder-fill element is further disposed on the fourth side surface.
 10. Amounting method of an electronic device, comprising: providing anelectronic device which comprises a semiconductor chip body including anupper surface, a lower surface opposite to the upper surface, and sidesurfaces connecting the upper surface and the lower surface, a pluralityof bumps disposed on the lower surface, and an under-fill elementdisposed on at least one side surface; mounting the electronic device ona printed circuit board including connecting pads formed thereon,wherein the bumps of the semiconductor chip body are connected to theconnecting pads; and heating the under-fill element to a predeterminedtemperature to form an under-fill layer between the lower surface of thesemiconductor chip body and the printed circuit board.
 11. The mountingmethod of claim 10, wherein, in the heating step, the bumps are at leastpartially melted and connected to the connecting pads, and theunder-fill element is melted into the liquid phase and forms theunder-fill layer.
 12. The mounting method of claim 11, wherein, in theproviding the electronic device step, the under-fill element is formedby filling a groove formed on at least one side surface with anunder-fill resin.
 13. The mounting method of claim 12, wherein eachgroove of the plurality of grooves extends along the side surface andtowards the lower surface of the semiconductor chip body, so that theunder-fill element formed in each groove of the plurality of grooves isexposed from the lower surface.
 14. The mounting method of claim 13,wherein each groove of the plurality of grooves and the under-fillelement have a semi-cylindrical shape or a triangular prism shape. 15.The mounting method of claim 14, wherein each groove of the plurality ofgrooves is disposed between two bumps adjacent to each other in a sidesurface view.
 16. The mounting method of claim 10, wherein, in theproviding the electronic device step, the under-fill element is formedby attaching an under-fill film onto at least one side surface.
 17. Themounting method of claim 16, wherein each side surface is substantiallyperpendicular to the lower and upper surfaces.
 18. The mounting methodof claim 10, wherein, in the providing the electronic device step, theside surfaces comprise a first side surface, a second side surfaceopposite to the first side surface, a third side surface and a fourthside surface opposite to the third side surface, and wherein theunder-fill element is disposed on the first side surface and the thirdside surface.
 19. The mounting method of claim 18, wherein theunder-fill element is further disposed on the fourth side surface.
 20. Amethod of manufacturing a display apparatus, comprising: providing anelectronic device which comprises a semiconductor chip body including anupper surface, a lower surface opposite to the upper surface, and sidesurfaces connecting the upper surface and the lower surface, a pluralityof bumps disposed on the lower surface, and an under-fill elementdisposed on at least one side surface; mounting the electronic device ona flexible substrate comprising a flexible material, and the flexiblesubstrate is a base substrate of the display apparatus, whereinconnecting pads are formed on the flexible substrate and are connectedto the bumps of the semiconductor chip body; and heating the under-fillelement to a predetermined temperature to form an under-fill layerbetween the lower surface of the semiconductor chip body and theflexible substrate.